8444-21B1-RK-TR
3M
CONN SOCKET PLCC 44POS TIN
Op voorraad11559 pcs
8444-21B1-RK-TR.pdf
160.0µin (4.06µm)
-40°C ~ 105°C
Surface Mount
Solder
PLCC
Closed Frame
UL94 V-0
Polybutylene Terephthalate (PBT), Glass Filled
0.050' (1.27mm)
Tin
160.0µin (4.06µm)
Tin
8400
44 (4 x 11)
Copper Alloy
0.050' (1.27mm)
Copper Alloy
0.132' (3.35mm)
15mOhm
1 A
8444
Tape & Reel (TR)
RFQ
123-93-322-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 22POS GOLD
Op voorraad46579 pcs
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Wire Wrap
DIP, 0.3' (7.62mm) Row Spacing
Open Frame
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100' (2.54mm)
Gold
30.0µin (0.76µm)
Tin-Lead
123
22 (2 x 11)
Beryllium Copper
0.100' (2.54mm)
Brass Alloy
0.510' (12.95mm)
-
3 A
123-93
Tube
RFQ
23-0503-20
Aries Electronics
CONN SOCKET SIP 23POS GOLD
Op voorraad46703 pcs
23-0503-20.pdf
200.0µin (5.08µm)
-
Through Hole
Wire Wrap
SIP
-
UL94 HB
Polyamide (PA), Nylon, Glass Filled
0.100' (2.54mm)
Gold
30.0µin (0.76µm)
Tin
0503
23 (1 x 23)
Beryllium Copper
0.100' (2.54mm)
Brass
0.360' (9.14mm)
-
3 A
23-0503
Bulk
RFQ
42-3574-16
Aries Electronics
CONN IC DIP SOCKET ZIF 42POS TIN
Op voorraad39689 pcs
42-3574-16.pdf
200.0µin (5.08µm)
-
Through Hole
Solder
DIP, ZIF (ZIP), 0.3' (7.62mm) Row Spacing
Closed Frame
UL94 V-0
Polyphenylene Sulfide (PPS), Glass Filled
0.100' (2.54mm)
Tin
200.0µin (5.08µm)
Tin
57
42 (2 x 21)
Beryllium Copper
0.100' (2.54mm)
Beryllium Copper
0.110' (2.78mm)
-
1 A
42-3574
Bulk
RFQ
614-83-652-41-001101
Preci-Dip
CONN IC DIP SOCKET 52POS GOLD
Op voorraad48570 pcs
-
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.6' (15.24mm) Row Spacing
Carrier, Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
0.100' (2.54mm)
Gold
29.5µin (0.75µm)
Tin
614
52 (2 x 26)
Beryllium Copper
0.100' (2.54mm)
Brass
0.136' (3.45mm)
10mOhm
1 A
614-83
Bulk
RFQ
24-1518-11
Aries Electronics
CONN IC DIP SOCKET 24POS GOLD
Op voorraad42873 pcs
24-1518-11.pdf
10.0µin (0.25µm)
-
Through Hole
Solder
DIP, 0.2' (5.08mm) Row Spacing
Open Frame
UL94 V-0
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100' (2.54mm)
Gold
10.0µin (0.25µm)
Gold
518
24 (2 x 12)
Beryllium Copper
0.100' (2.54mm)
Brass
0.125' (3.18mm)
-
3 A
24-1518
Bulk
RFQ
124-91-650-41-002000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
Op voorraad36539 pcs
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Wire Wrap
DIP, 0.6" (15.24mm) Row Spacing
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Tin-Lead
124
50 (2 x 25)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.630" (16.00mm)
10mOhm
3 A
124-91
Tube
RFQ
114-43-310-41-117000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
Op voorraad43190 pcs
114-43-310-41-117000.pdf
200.0µin (5.08µm)
-55°C ~ 125°C
Surface Mount
Solder
DIP, 0.3" (7.62mm) Row Spacing
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin
114
10 (2 x 5)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
-
10mOhm
3 A
114-43
Tube
RFQ
24-0518-10
Aries Electronics
CONN SOCKET SIP 24POS GOLD
Op voorraad38378 pcs
24-0518-10.pdf
200.0µin (5.08µm)
-
Through Hole
Solder
SIP
Open Frame
UL94 V-0
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100' (2.54mm)
Gold
10.0µin (0.25µm)
Tin
518
24 (1 x 24)
Beryllium Copper
0.100' (2.54mm)
Brass
0.125' (3.18mm)
-
3 A
24-0518
Bulk
RFQ
522-93-299-20-096002
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
Uit voorraad
200.0µin (5.08µm)
-
Through Hole
Wire Wrap
PGA
-
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin-Lead
522
299 (20 x 20)
-
0.100" (2.54mm)
-
0.370" (9.40mm)
-
-
522-93
Bulk
RFQ
116-41-210-41-008000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
Op voorraad40414 pcs
116-41-210-41-008000.pdf
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.2" (5.08mm) Row Spacing
Elevated, Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Tin
116
10 (2 x 5)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.472" (11.99mm)
10mOhm
3 A
116-41
Tube
RFQ
510-13-142-15-085002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
Op voorraad36126 pcs
510-13-142-15-085002.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Gold
510
142 (15 x 15)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.125" (3.18mm)
10mOhm
3 A
510-13
Bulk
RFQ
511-93-084-10-031001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
Uit voorraad
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin-Lead
511
84 (10 x 10)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.170" (4.32mm)
10mOhm
3 A
511-93
Bulk
RFQ
614-43-424-31-002000
Mill-Max Manufacturing Corp.
SKT CARRIER PGA
Op voorraad47337 pcs
614-43-424-31-002000.pdf
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.4" (10.16mm) Row Spacing
Carrier, Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin
614
24 (2 x 12)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.136" (3.45mm)
10mOhm
3 A
614-43
Tube
RFQ
510-13-085-10-031003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
Op voorraad42915 pcs
510-13-085-10-031003.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Gold
510
85 (10 x 10)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.125" (3.18mm)
10mOhm
3 A
510-13
Bulk
RFQ
9-6437529-4
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 8POS GOLD
Uit voorraad
9-6437529-4.pdf
-
-
Through Hole, Right Angle, Horizontal
Solder
DIP, 0.6" (15.24mm) Row Spacing
Closed Frame
UL94 V-0
Thermoplastic, Polyester
0.100" (2.54mm)
Gold
-
Tin
-
8 (2 x 4)
Beryllium Copper
0.100" (2.54mm)
Brass
0.125" (3.18mm)
-
-
6437529
Bulk
RFQ
24-3554-16
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS
Op voorraad36105 pcs
24-3554-16.pdf
50.0µin (1.27µm)
-
Through Hole
Solder
DIP, ZIF (ZIP), 0.3' (7.62mm) Row Spacing
Closed Frame
UL94 V-0
Polyphenylene Sulfide (PPS), Glass Filled
0.100' (2.54mm)
Nickel Boron
50.0µin (1.27µm)
Nickel Boron
55
24 (2 x 12)
Beryllium Copper
0.100' (2.54mm)
Beryllium Copper
0.110' (2.78mm)
-
1 A
24-3554
Bulk
RFQ
146-87-624-41-035101
Preci-Dip
CONN IC DIP SOCKET 24POS GOLD
Op voorraad31229 pcs
-
-55°C ~ 125°C
Through Hole
Press-Fit
DIP, 0.6' (15.24mm) Row Spacing
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
0.100' (2.54mm)
Gold
Flash
Tin
146
24 (2 x 12)
Beryllium Copper
0.100' (2.54mm)
Brass
0.150' (3.81mm)
10mOhm
1 A
146-87
Bulk
RFQ
123-13-420-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 20POS GOLD
Op voorraad42759 pcs
123-13-420-41-001000.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Wire Wrap
DIP, 0.4' (10.16mm) Row Spacing
Open Frame
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100' (2.54mm)
Gold
30.0µin (0.76µm)
Gold
123
20 (2 x 10)
Beryllium Copper
0.100' (2.54mm)
Brass Alloy
0.510' (12.95mm)
-
3 A
123-13
Tube
RFQ
42-6554-11
Aries Electronics
CONN IC DIP SOCKET ZIF 42POS GLD
Op voorraad34854 pcs
42-6554-11.pdf
-
-
Through Hole
Solder
DIP, ZIF (ZIP), 0.6' (15.24mm) Row Spacing
Closed Frame
UL94 V-0
Polyphenylene Sulfide (PPS), Glass Filled
0.100' (2.54mm)
Gold
-
Gold
55
42 (2 x 21)
Beryllium Copper
0.100' (2.54mm)
Beryllium Copper
0.110' (2.78mm)
-
1 A
42-6554
Bulk
RFQ
36-0508-20
Aries Electronics
CONN SOCKET SIP 36POS GOLD
Op voorraad30669 pcs
36-0508-20.pdf
10.0µin (0.25µm)
-55°C ~ 105°C
Through Hole
Wire Wrap
SIP
-
UL94 V-0
Polyamide (PA46), Nylon 4/6
0.100' (2.54mm)
Gold
10.0µin (0.25µm)
Gold
508
36 (1 x 36)
Beryllium Copper
-
Brass
0.360' (9.14mm)
-
3 A
36-0508
Bulk
RFQ
08-1518-10T
Aries Electronics
CONN IC DIP SOCKET 8POS GOLD
Op voorraad48165 pcs
08-1518-10T.pdf
200.0µin (5.08µm)
-
Through Hole
Solder
DIP, 0.2" (5.08mm) Row Spacing
Open Frame
UL94 V-0
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Tin
518
8 (2 x 4)
Beryllium Copper
0.100" (2.54mm)
Brass
0.125" (3.18mm)
-
3 A
08-1518
Bulk
RFQ
14-6513-11H
Aries Electronics
CONN IC DIP SOCKET 14POS GOLD
Op voorraad31607 pcs
14-6513-11H.pdf
10.0µin (0.25µm)
-55°C ~ 105°C
Through Hole
Solder
DIP, 0.6" (15.24mm) Row Spacing
Closed Frame
UL94 V-0
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Gold
Lo-PRO®file, 513
14 (2 x 7)
Beryllium Copper
0.100" (2.54mm)
Brass
0.125" (3.18mm)
-
3 A
14-6513
Bulk
RFQ
08-6503-21
Aries Electronics
CONN IC DIP SOCKET 8POS GOLD
Op voorraad35013 pcs
08-6503-21.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Wire Wrap
DIP, 0.6' (15.24mm) Row Spacing
Closed Frame
UL94 V-0
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100' (2.54mm)
Gold
10.0µin (0.25µm)
Gold
503
8 (2 x 4)
Beryllium Copper
0.100' (2.54mm)
Phosphor Bronze
0.360' (9.14mm)
-
3 A
08-650
Bulk
RFQ
175-PGM16008-11
Aries Electronics
CONN SOCKET PGA GOLD
Op voorraad33239 pcs
175-PGM16008-11.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
-
UL94 V-0
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Gold
PGM
-
Beryllium Copper
0.100" (2.54mm)
Brass
0.165" (4.19mm)
-
3 A
175-PGM
Bulk
RFQ
522-93-133-13-045003
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
Uit voorraad
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Wire Wrap
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin-Lead
522
133 (13 x 13)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.370" (9.40mm)
10mOhm
3 A
522-93
Bulk
RFQ
515-91-400-20-000001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
Uit voorraad
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Closed Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Tin-Lead
515
400 (20 x 20)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.108" (2.74mm)
10mOhm
3 A
515-91
Bulk
RFQ
104-11-304-41-780000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
Op voorraad46263 pcs
104-11-304-41-780000.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Press-Fit
DIP, 0.3" (7.62mm) Row Spacing
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Gold
104
4 (2 x 2)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.250" (6.35mm)
10mOhm
3 A
104-11
Tube
RFQ
110-41-432-41-105000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
Op voorraad47789 pcs
110-41-432-41-105000.pdf
200.0µin (5.08µm)
-55°C ~ 125°C
Surface Mount
Solder
DIP, 0.4" (10.16mm) Row Spacing
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Tin
110
32 (2 x 16)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.125" (3.18mm)
10mOhm
3 A
110-41
Tube
RFQ
510-87-237-17-061101
Preci-Dip
CONN SOCKET PGA 237POS GOLD
Op voorraad35229 pcs
-
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
0.100' (2.54mm)
Gold
Flash
Tin
510
237 (17 x 17)
Beryllium Copper
0.100' (2.54mm)
Brass
0.125' (3.18mm)
10mOhm
1 A
510-87
Bulk
RFQ
APA-624-T-B
Samtec Inc.
ADAPTER PLUG
Uit voorraad
-
-
Through Hole
Solder
-
Open Frame
UL94 V-0
Polybutylene Terephthalate (PBT), Glass Filled
0.100" (2.54mm)
Tin
-
Tin
APA
24 (2 x 12)
Phosphor Bronze
0.100" (2.54mm)
Phosphor Bronze
-
-
-
APA-624
Bulk
RFQ
1571539-1
TE Connectivity AMP Connectors
CONN SOCKET PLCC 20POS TIN
Uit voorraad
1571539-1.pdf
180.0µin (4.57µm)
-55°C ~ 125°C
Through Hole
Solder
PLCC
Closed Frame
UL94 V-0
Polyphenylene Sulfide (PPS), Glass Filled
0.100' (2.54mm)
Tin
180.0µin (4.57µm)
Tin
-
20 (4 x 5)
Copper Alloy
0.100' (2.54mm)
Copper Alloy
0.130' (3.30mm)
-
-
1571539
Bulk
RFQ
614-13-133-14-071012
Mill-Max Manufacturing Corp.
SKT CARRIER PGA
Uit voorraad
614-13-133-14-071012.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Carrier, Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Gold
614
133 (14 x 14)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.136" (3.45mm)
10mOhm
3 A
614-13
Bulk
RFQ
14-3511-11WR
Aries Electronics
CONN IC DIP SOCKET 14POS GOLD
Op voorraad39285 pcs
14-3511-11WR.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.3' (7.62mm) Row Spacing
Closed Frame
UL94 V-0
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100' (2.54mm)
Gold
10.0µin (0.25µm)
Gold
511
14 (2 x 7)
Phosphor Bronze
0.100' (2.54mm)
Phosphor Bronze
0.150' (3.81mm)
-
1 A
14-3511
Bulk
RFQ
511-91-155-16-003002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
Uit voorraad
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Tin-Lead
511
155 (16 x 16)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.170" (4.32mm)
10mOhm
3 A
511-91
Bulk
RFQ
346-93-132-41-012000
Mill-Max Manufacturing Corp.
SOCKET SLDRLSS PRESSFIT SIP32POS
Op voorraad32726 pcs
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Press-Fit
SIP
-
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin-Lead
-
32 (1 x 32)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
-
-
-
-
-
RFQ
116-47-328-41-001000
Mill-Max Manufacturing Corp.
STANDRD SOLDRTL DBL SKT
Op voorraad33376 pcs
116-47-328-41-001000.pdf
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.3" (7.62mm) Row Spacing
Elevated, Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
Flash
Tin
116
28 (2 x 14)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.594" (15.09mm)
10mOhm
3 A
116-47
Tube
RFQ
614-13-181-14-031012
Mill-Max Manufacturing Corp.
SKT CARRIER PGA
Uit voorraad
614-13-181-14-031012.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Carrier, Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Gold
614
181 (14 x 14)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.136" (3.45mm)
10mOhm
3 A
614-13
Bulk
RFQ
515-13-159-16-105003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
Uit voorraad
515-13-159-16-105003.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Gold
515
159 (16 x 16)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.108" (2.74mm)
10mOhm
3 A
515-13
Bulk
RFQ
551-90-114-15-063005
Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
Uit voorraad
551-90-114-15-063005.pdf
200.0µin (5.08µm)
-
Through Hole
Solder
PGA
-
-
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Tin-Lead
551
114 (15 x 15)
-
0.100" (2.54mm)
Brass Alloy
0.154" (3.91mm)
-
-
551-90
Bulk
RFQ
36-1518-11
Aries Electronics
CONN IC DIP SOCKET 36POS GOLD
Op voorraad43226 pcs
36-1518-11.pdf
10.0µin (0.25µm)
-
Through Hole
Solder
DIP, 0.2" (5.08mm) Row Spacing
Open Frame
UL94 V-0
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Gold
518
36 (2 x 18)
Beryllium Copper
0.100" (2.54mm)
Brass
0.125" (3.18mm)
-
3 A
36-1518
Bulk
RFQ
110-93-964-61-001000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
Op voorraad46355 pcs
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.9" (22.86mm) Row Spacing
-
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin-Lead
110
64 (2 x 32)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.125" (3.18mm)
10mOhm
3 A
110-93
Tube
RFQ
34-0511-11
Aries Electronics
CONN SOCKET SIP 34POS GOLD
Op voorraad30542 pcs
34-0511-11.pdf
10.0µin (0.25µm)
-55°C ~ 125°C
Through Hole
Solder
SIP
-
UL94 V-0
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100' (2.54mm)
Gold
10.0µin (0.25µm)
Gold
511
34 (1 x 34)
Phosphor Bronze
0.100' (2.54mm)
Phosphor Bronze
0.150' (3.81mm)
-
1 A
34-0511
Bulk
RFQ
24-6501-20
Aries Electronics
CONN IC DIP SOCKET 24POS TIN
Op voorraad28865 pcs
24-6501-20.pdf
200.0µin (5.08µm)
-55°C ~ 105°C
Through Hole
Wire Wrap
DIP, 0.6" (15.24mm) Row Spacing
Closed Frame
UL94 V-0
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Tin
501
24 (2 x 12)
Phosphor Bronze
0.100" (2.54mm)
Phosphor Bronze
0.410" (10.41mm)
-
1.5 A
24-650
Bulk
RFQ
116-47-328-41-007000
Mill-Max Manufacturing Corp.
STANDRD SOLDRTL DBL SKT
Op voorraad40307 pcs
116-47-328-41-007000.pdf
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.3" (7.62mm) Row Spacing
Elevated, Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
Flash
Tin
116
28 (2 x 14)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.402" (10.21mm)
10mOhm
3 A
116-47
Tube
RFQ
146-83-624-41-035101
Preci-Dip
CONN IC DIP SOCKET 24POS GOLD
Op voorraad35061 pcs
-
-55°C ~ 125°C
Through Hole
Press-Fit
DIP, 0.6" (15.24mm) Row Spacing
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Tin
146
24 (2 x 12)
Beryllium Copper
0.100" (2.54mm)
Brass
0.150" (3.81mm)
10mOhm
1 A
146-83
Bulk
RFQ
510-91-225-18-091003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
Op voorraad31623 pcs
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Tin-Lead
510
225 (18 x 18)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.125" (3.18mm)
10mOhm
3 A
510-91
Bulk
RFQ
532-AG11D-ESL
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 32POS GOLD
Uit voorraad
532-AG11D-ESL.pdf
-
-55°C ~ 125°C
Through Hole
Solder
DIP, 0.6' (15.24mm) Row Spacing
Closed Frame
UL94 V-0
Polyester
0.100' (2.54mm)
Gold
5.00µin (0.127µm)
Gold
500
32 (2 x 16)
Copper Alloy
0.100' (2.54mm)
Copper Alloy
0.125' (3.18mm)
10mOhm
3 A
532
Tube
RFQ
515-93-073-11-061002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
Uit voorraad
200.0µin (5.08µm)
-55°C ~ 125°C
Through Hole
Solder
PGA
Open Frame
UL94 V-0
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Tin-Lead
515
73 (11 x 11)
Beryllium Copper
0.100" (2.54mm)
Brass Alloy
0.108" (2.74mm)
10mOhm
3 A
515-93
Bulk
RFQ
16-8500-310C
Aries Electronics
CONN IC DIP SOCKET 16POS GOLD
Op voorraad38102 pcs
16-8500-310C.pdf
10.0µin (0.25µm)
-55°C ~ 105°C
Through Hole
Solder
DIP, 0.3" (7.62mm) Row Spacing
Closed Frame, Elevated
UL94 V-0
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Gold
8
16 (2 x 8)
Beryllium Copper
0.100" (2.54mm)
Brass
0.140" (3.56mm)
-
3 A
16-8500
Bulk
RFQ